Mask aligner for multichip modules

03/01/1999

Mask aligner for multichip modules

The MA 200CC is a fully automatic production mask aligner for the fabrication of MCM-D substrates. MCM-D modules are formed by the deposition of thin filmmetals and dielectrics, which may be polymers or inorganic dielectrics. The new aligner achieves very good printing results in photo-BCB, which is increasingly used as a dielctric material in MCMs. High-density MCMs can effectively package advanced ICs while maintaining the inherent size and speed advantages that are often lost when using individually packaged chips. The new tool is suitable for designs down to 5 ?m, and it is intended to meet future requirements for photolithography in MCM-D technology. Its large depth of focus is highly suitable for patterning substrates with uneven surfaces. The field-proven handling system can reliably transport almost every type of substrate up to 8 ? 8 in., and full-field exposure up to 8 ? 8 in. allows the patterning of large modules with no stitching errors. Karl Suss, Munich, Germany; ph 49/89-320-07149, fax 49/89-320-07129, e-mail [email protected], www.suss.com.