UV exposures systems

03/01/1999

UV exposure systems

Models UH102 (for 200-mm wafers) and UH102-12 (300-mm) reduce adhesion of UV-sensitive film, allowing easy removal of die after dicing, backgrinding, and other processes. Their highly controlled environment ensures uniform UV exposure of wafers or other substrates. The system features a compact, manually operated, tabletop configuration, and accepts any size wafer/saw frame or grip ring. A serpentine-style, ozone-free grid lamp gives even, consistent UV exposure, and N2 purge ensures efficient curing of the adhesive. Benefits of the system include easier post-saw die removal than with conventional films; higher dicing yield than that of standard adhesive films; and low-stress removal of die from the film of ultrathin or fragile wafers during pick-and-place operations, resulting in higher yields. Ultron Systems Inc., Moorpark, CA; ph 805/529-1485, fax 805/523-1061, e-mail [email protected], www.ultronsystems.com.