Flip chip bonder enhancement

03/01/1999

Flip chip bonder enhancement

A 4-kg bond load feature is now available as an option for the Model 850 flip chip bonder. The option extends the system`s bond load capability from its standard 400 gm, thus complementing the recent hot gas spot heater and heated stage options for greater system versatility. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293 ext 21, fax 805/529-2193, www.semicorp.com.