Team provides OPC-defect printability test reticle
03/01/1999
Team provides OPC-defect printability test reticle
MicroUnity Systems Engineering, Photronics, Applied Materials, and Benchmark Technologies have developed a special reticle to test printability of different types of OPC mask defects (see figure). Their respective roles in the reticle`s developement are the following:
Software supplier MicroUnity created the reticle pattern with common OPC features and intentional defects, including bridging and bumps to emulate particles or excess chrome, holes and edge intrusions ("mousebites"), and linewidth errors. These patterns were duplicated to allow either die-to-die or die-to-database inspection.
Using its proprietary maskmaking process, Photronics produced sample reticles for testing and ensuring they were reproducible.
Applied Materials used the test masks to fine-tune its mask defect-detection software.
Test-reticle supplier Benchmark Technologies has taken over design, support, and supply of the reticle, including customization for specific applications using MicroUnity OPC software.
"The success of this project proves that the industry has the technology required to design and manufacture high quality OPC masks," said Roger Caldwell, VP of silicon technology at MicroUnity. "This is the first defect mask generated completely from software, giving the opportunity to modify the design easily and rapidly, so the parameters can be customized for specific applications." Steve Carlson, VP of technology for Photronics adds, "The improved confidence this reticle can add to defect inspection enhances the value of OPC and will accelerate its integration into broad-based semiconductor fabrication."
Wolf Staud, Applied Materials` product marketing manager for reticle inspection, says, "For the first time, this defect sensitivity reticle offers the industry a direct link from reticle inspection tool sensitivity to wafer printability. By allowing the end users to have these patterns manufactured by their usual mask supplier, the full manufacturability of OPC can be evaluated from design, through reticle-write, process, and inspection, to actual defect printability in the wafer fab." - P.B.