Mitsubishi develops LSIs

03/01/1999

Mitsubishi develops LSIs

Mitsubishi Electric Corp. plans to develop volume system LSIs in the second half of 2000 using a hybrid copper-aluminum interconnect structure and 0.18-?m design rules. Initial targets for the technology will be high-speed logic LSI solutions for server and network applications; the structure will later be used in Mitsubishi`s eRAM products. By combining copper and aluminum structures, Mitsubishi is able to achieve device speeds 15% faster than similar structures composed of only aluminum interconnects, and 5% faster than copper-only interconnects. In Mitsubishi`s six-level structure, copper is used for long-distance interconnects with coarse metal pitch in the top two levels, while a conventional aluminum alloy is used for short-distance interconnects with fine metal pitch in the bottom four levels.

Mitsubishi also has been able to build BST capacitors using a CVD method that incorporates a vapor solution of BST material.

In addition, the company said it has developed a highly reliable, thick-film electrode using oxygenated platinum, which improves electrical characteristics and yield in the early stages of production, as well as through the back-end process. - C.L