IMEC ASML alliance sees results
02/01/1999
IMEC-ASML alliance sees results
ASML`s 193-mm step-and-scan system has demonstrated imaging capabilities for 100-nm R&D, a result of a joint 193-nm process development alliance formed two years ago by Belgium`s IMEC and the Netherlands` ASML. Other results show that the system appears to be compatible with pilot
line production of ICs corresponding to 130-nm device design rules and beyond. The system will become
operational in the first half of this year in a special 193-nm lithography facility adjacent to IMEC`s pilot line.
The program comprises sub-programs dealing with 193-nm resist evaluations, exposure tool assessment in pilot line production, resolution enhancement techniques, and lithography process development focusing on the 130-nm and then 100-nm technology nodes. The program has attracted semiconductor companies, mask shops, and resist manufacturers. By pooling their technological resources, all participants will gain early process knowledge at a lower cost than individually funded R&D work.
In addition, IMEC and De Neef Chemical Recycling N.V. have signed an agreement for further evaluation of IMEC`s recycled resist strippers, particularly with regard to their efficiency for reuse.
ESEC raises funds and reorganizes
Faced with substantial losses in the current year, and expecting little improvement over the next 12 months, Swiss back-end equipment producer ESEC has implemented several financial measures to raise cash. These include the sale of a 32% stake in the company by founder Karl Nicklaus to the Roche pharmaceutical firm. ESEC shareholders are also being given the chance to purchase an additional share of ESEC stock at 800 francs for every two shares already owned. Roche has agreed to exercise its options, contributing about 62 million francs to an overall goal of 100 million (US$70 million). To reduce its debt load, ESEC is also offering bond holders the opportunity to voluntarily convert 33 million francs` worth of existing convertible notes to equity at par value.
ESEC has also reorganized into equipment, systems, and trading divisions. The equipment division is the biggest and includes die bond, wire bond, and flip chip tools. The systems unit will combine the Autoline integrated assembly system, and the smaller smart card assembly line and the Dutch BDM encapsulation packaging unit. The trading unit, based in North Carolina, purchases, modifies, and re-sells equipment for placement of encapsulated chips on PC boards under a partnership with Juki of Japan. ESEC has laid off about 80 people in its second major work force reduction of the year. Overall, ESEC now has about 900 employees. - P.N.D.