Dual-line encapsulation

02/01/1999

Dual-lane encapsulation

ENCore Dual Lane Encapsulation systems offer the continuous benefits of dual-lane processing for advanced packaging and assembly encapsulation applications, including die coat, dam and fill, glob top, chip underfill, and cavity fill. Because they are modular, they can be expanded into multi-unit systems. Ergonomic design, coupled with sophisticated control and process monitoring, offer features that include on- or off-line programming, self-diagnostic software, and a powerful Windows NT environment. MRSI, Chelmsford, MA; ph 978/256-4950, fax 978/256-5120, e-mail [email protected].