Europe

02/01/1999

Europe

STEAG Electronic Systems, Pliezhausen, Germany, is in discussions for a cash acquisition of AG Associates, San Jose, CA, a supplier of rapid thermal processing equipment. The acquisition is expected to value the equity of AG in excess of $30 million. In addition, STEAG has delivered its MECAPOL E550 polishing system to the French Institute LETI for polishing silicon and silicon dioxide. The dry-in/wet-out process is designed for 200-mm and smaller wafer sizes.

Siemens` Semiconductor Group will become an independent company, and is eyeing an IPO in FY00. The spun-out chipmaking unit will be part of a larger restructuring of operations. The semiconductor group reported losses of $716 million for fiscal 1998, and has shutdown its North Tyneside fab in the UK.

Under a joint development project with Japan`s Super Silicon Institute, CMP firm Peter Wolters has recently completed processing 400-mm wafers on its AC 1500 double-side polishing machine. Processing took place at Wolters` facility in Rendsburg, Germany, and the tool is slated for installation in Japan.