Flip chip/die bonder

01/01/1999

Flip chip/die bonder

Model CB-5H fully automated flip chip bonder is a modular, granite-based machine that can accept a wafer handler with flipper and from one to four 8-in. wafers, withdie sizes varying from 0.3 to 25 mm. The automatic substrate handler can load and unload boats, boards, and frames con-structed from such materials as Flex, FR-4, PWB, and ceramics. Additional die presentation options are waffle packs, gel packs, and tape feeders. The system performs high-accuracy and high-force flip chip/die bonding in all modes of operation, from prototyping to full production. Geared to handle chips up to 1 in., it can place various die onto different-sized substrates up to 10 ? 10 in. Research Devices Inc., Piscataway, NJ; ph 732/572-4800, fax 732/572-4808.