Issue

Chip carrier cleaners

01/01/1999

Chip carrier cleaners

The LFC 100 and LFC 150 chip carrier cleaners plasma-clean the carriers in standard magazines. This cleaning step increases wirebonding and molding yields for PBGA, TBGA, fpBGA, and QFP-type packages. The method offers the following advantages: no sputtering and re-deposition; no electronic damage to sensitive chips; and no damage to plastic chip-carrier materials and polyimide. Balzers Instruments, Balzers, Liechtenstein; ph 41/75-388-4368, fax 41/75-388-5429,

e-mail [email protected], www.bi.balzers.com.