Spin-o polymer

01/01/1999

Spin-on polymer

PureSpin advanced spin-on polymer, for use in intermetal dielectric applications, will help to make non-etchback processes the standard in DRAM manufacturing, eliminating several steps currently used with the partial-etchback methodology. PureSpin is compatible with isopropyl alcohol, allowing easy integration into current equipment configurations. It is formulated to form a crack-free, low-k (3.1) interlayer dielectric to fill gaps as small as 0.1 ?m without voids. The dense nature of the dielectric film formed provides good oxygen plasma resistance to alternative spin-on materials during photoresist ashing, resulting in a relatively trouble-free via-fill process. AlliedSignal Advanced Microelectronic Materials, Sunnyvale, CA; ph 408/962-2000, fax 408/980-1430, e-mail [email protected], www.allied signal.com.