Copper interconnect process module

01/01/1999

Copper interconnect process module

Applied Materials has unveiled the first off-the-shelf offering from its process sequence integration division, a copper interconnect process module now in demonstration at its new equipment process integration center (EPIC).

The copper process module, or equipment set solution (ESS), meets baseline levels of performance, yielding 0.60-?m pitch lines, and 0.30-?m vias with <0.75 W/via resistance. While the goal is to have a 20-day cycle time for a two-level copper metal process, the current cycle time is 35 days, says Tom St. Dennis, corporate group VP.

Applied expects additional process sequences developed at the EPIC center will also meet baseline levels of performance, leaving room for the end-user to fine-tune the sequence to improve performance with specific chip designs. Assuming that the rest of the equipment and materials industry is also moving in the direction of integration responsibility, new alliances will be formed to offer other comparable equipment sets. If this happens, some fabs may find themselves buying a series of sequences that end up nearly indistinguishable from the process capabilities of foundries.

"Many of our customers are talking about moving some of their production to foundries. Process development is not key to their competitiveness," says Sass Somekh, senior VP.

The copper interconnect module, slated to be ready for delivery in 2Q of FY99, includes Applied`s Centura deposition tooling, dielectric etch IPS Centura, 7830Si CD-SEM, Endura Electra Cu system, Mirra CMP system, WF736 DUO defect detection system, and SEMVision defect review SEM, along with low-k, electroplating, and low temperature annealing technologies.

The EPIC center was recently completed under a $430 million R&D investment in the firm`s Santa Clara facilities. The center incorporates Workstream DFS and Fab300 MES software from Consilium, which is being acquired by Applied. SMIF pods are used for wafer transport. A DUV lithography cell is housed in nearby buildings. Currently 200-mm capable, the center can be expanded to 300-mm as demand arises.

Also taking part are technology partners ASM Lithography (DUV stepper), Electroglas (prober), Hewlett-Packard (tester), TestChip Technologies (CMP test structures), and Sandia Technologies (WLR test structures and methods). - E.K., C.L.