Die inspection system

12/01/1996

Die inspection system

This vision inspection system is designed to verify that only good die have been picked from a wafer (and no bad die). It incorporates a Cognex vision board and proprietary algorithms to perform the necessary intelligent inspection; and it is connected to a host computer to receive wafer maps directly via a barcode scanner. Included in the package are a computer, vision processor, wafer fixture, backlight illumination, camera, lens, barcode scanner, and proprietary operations software. The system can be used for 150- and 200-mm wafers and can be custom-configured for 300-mm wafers. Additional applications and options allow wafer carrier-to-wafer carrier transportation, good die removal, and waffle pack loading or inspection. Zmation Inc., Portland, OR; ph 503/654-9793, fax 503/653-5334, e-mail [email protected]