DUV photoresists

12/01/1996

DUV photoresists

These two positive-tone, chemically amplified resists, DX-1200P and DX-1300P, are characterized by standard processes, wide latitudes, good lithographic performance, and high reliability. They also provide adequate delay time stability and low sensitivity to environmental contamination. DX-1300P is designed for high-resolution line and space patterns. Features include: low isolated to dense bias (within CD specifications); high sensitivity (=20 mJ/cm2); high resolution (linear to 0.2 ?m on a 0.55 NA stepper); wide depth of focus (>1.05?m for 0.25-?m lines and spaces); high thermal stability (~130?C); and good delay time stability (>3 hours). DX-1200P is designed for contact hole patterns, and its features include: high sensitivity (=40mJ/cm2 for 0.25-?m contact holes); good depth of focus (>1.25 ?m for 0.25-?m contact holes on silicon); and stable delay time. AZ Photoresist Products/Hoechst Celanese Corp., Somerville, NJ; ph 908/429-3616.