Die-matrix expander

12/01/1996

Die-matrix expander

Model UH 130 is a die-matrix expander that reduces throughput time and increases yield by gently separating die on adhesive tape after wafer sawing or scribe and break operations. After expansion of the wafer, an evenly spaced matrix of die results, facilitating die pickup and eliminating the possibility of die scraping against one another. The UH 130 handles wafers of up to 8-in. diameter, adapts to any size wafer/film frame, accommodates carrier rings or grip rings, and maintains parallel alignment of streets and alleys to present die for consistent pickup. It has a temperature-controlled heated stage and 3-in. stroke with speed control for controlled expansion, and an adjustable stroke stop for different expansion requirements. Ultron Systems Moorpark, CA; ph 805/529-1485, fax 805/523-1061.