Substrates for BGA fabrication

12/01/1996

Substrates for BGA fabrication

ViperBGA substrates are based on a photo-imageable dielectric process called Micro-filled Via. Because this technology does not require the mechanical drilling of vias, it can reduce BGA fabrication costs significantly. The technology provides for via-in-pad layouts, permitting staggered bonding pads to accommodate small die. Via-in-pad layouts reduce bond wire length for a given pin count, thereby increasing electrical performance. Multiple layers allow efficient routing and the use of power and ground planes to improve electrical and thermal performance. ViperBGA packages enjoy better thermal impedance characteristics than either PBGAs or PQFPs, having a low theta JA (9-11?C/W for a 352 BGA package). This permits 5-6W power dissipation with no air flow. ProLinx Labs, San Jose, CA; ph 408/227-0707, fax 408/227-6529, http://www.prolinx.com