Chip encapsulant

12/01/1996

Chip encapsulant

EPO-TEK T7139 is a thermally conductive, electrically insulating epoxy formulation designed for use as a "glob-top" encapsulant. It encapsulates chips and protects them from damage during micropackage assembly and handling. Advantages include a low coefficient of thermal expansion; good resistance to moisture, contamination, and most solvents; and low levels of hydrolyzable ions and outgassing. Its solvent-free, two-component formulation has a shelf life of one year at room temperature and a pot life > 16 hours. It cures in 30 min. at 150?C or in 60 min. at 125?C. The glass transition temperature is 121?C and it is rated up to 175?C (continuous) and 300?C (intermittent). Degradation temperature is 415?C. Epoxy Technology, Billerica, MA; ph 800/227-2201 or 508/667-3805, fax 508/663-9782.