Photoresist removal process

12/01/1996

Photoresist removal process

With its capacity for 100-wafer lot sizes, the GAMA-2 automated wet station processes double lots without impacting footprint and chemical costs. By doubling wafer transport lots, throughput is increased proportionately. In post-ash resist strip processes, for instance, the GAMA-2 raises throughput from around 200 to 400 wph. Use of the chemical-free photoresist strip process in conjunction with the post-ash resist strip processes increases throughput even further - to 500 wph. Based on a chemical blend of ozone and chilled DI water rather than sulfuric acid, the DIO3 process performs photoresist stripping with superior process performance and latitude, reducing footprint and cutting chemical costs. SubMicron Systems Corp., Allentown, PA; ph 408/496-1177 or 610/391-9200, fax 610/391-9412.