Multihead polishing for CMP

12/01/1996

Multihead polishing for CMP

Auriga is designed to improve the overall CMP process,significantly increasing reliability and throughput. It is a five-head, two-table system with integrated multiple process control - an advanced design that permits multitasking of tool automation so that each component is fully optimized. Throughput is up to 100 wafers/hour in continuous feed operation. Additionally, the Auriga system incorporates future dry-in/dry-out capabilities with the Capella post-CMP wafer cleaning system, as well as endpoint detection for both oxide and tungsten. SpeedFam Corp., Chandler, AZ; ph 602/961-1600, fax 602/961-7577.