Multichip die bonder

12/01/1996

Multichip die bonder

The PPS 2200 series die bonder offers totally modular hardware and software for multichip applications. It may consist of between one and four modules of identical design. Arranged in a line, they are capable of assembling four different or identical components at the same time, working independently of each other. Small yet powerful autonomous processors are connected to a central computer by a high-speed CAN bus and handle a large part of the real-time requirements. Four types of nodes are capable of managing pneumatic cylinders, DC motors, step motors, and even the proprietary image processing system. Datacon, Radfeld, Austria; ph 43/5337-648340, fax 43/5337-648349.