Thanks for the news

12/01/1996

Thanks for the news

I would like to express my appreciation for the fine article you wrote about our microcleaving product ("Israeli group develops improved wafer cleaving," September 1996, p. 48). It was a joy to read.

There was one inaccuracy that could cause a misconception about the system. You stated, "Fine tuning of the cross-section can be accomplished with a few minutes of FIB etching, since micro-cleaving starts within microns of the desired location." In fact, microcleaving achieves submicron accuracies and for the bulk of cases FIB etching is not necessary, thereby allowing the MC100 to be conceived as a stand-alone solution.

Once again, thank you for your interest in our product and it was flattering to be included in the Technology News section of your magazine.

Regards,

Colin Smith

Semiconductor Engineering Labs

Israel