Sputtering magnetron

11/01/1996

Sputtering magnetron

A new sputtering magnetron uses a unique approach to push magnetic flux through a ferrous target more effectively, facilitating a higher degree of plasma control in the sputtering chamber and greatly improving target utilization. The essence of the new technology is the carefully determined and applied magnetic field that controls plasma in the sputtering process. The presence of the field optimally positions the plasma with respect to the target, allowing a faster process and more efficient use of the target material. Each sputtering magnetron is custom-engineered to meet the user`s specific needs. Dexter Magnetic Materials Div., Fremont, CA; ph 510/656-5700, fax 510/668-5429.