Die-loading system

11/01/1996

Die-loading system

The 2007 TR die-loading system handles the full range of carrier tapes. Its flexible design allows it to run die sizes ranging from 1.0-11 mm and can be extended to accommodate die sizes up to 25 mm. Maximum wafer size is 8 in., and tape width can vary from 8-56 mm using embossed standard EIA 481 tape, Surftape, or any other customer tape. System composition makes possible conversion from one prod-

uct to another within minutes without changeover kits. The 2007 TR can load up to 5000 die/hour. The system is designed to recognize good chips, pick them up automatically, and place them into the cavity of the carrier tape. A synchronized die eject/die pickup feature is used to remove the die by the bondhead from the film. Finally, the die is placed into the cavity of the carrier tape. The indexer forwards the tape to the sealing unit, where a transparent cover tape is laminated by heat and/or pressure onto the carrier tape and the cavity sealed off. ESEC USA Inc., Phoenix, AZ; ph 602/893-6990, fax 602/893-6793.