Flip chip bonder

11/01/1996

Flip chip bonder

Model 410 is a flip chip bonder for development and low-volume production, combining precision alignment and versatile, fast-cycle operation with spot heating achieved by either high-intensity light or hot gas. The bonder features a cube beam splitter tied to a super VGA monitor that presents the die and substrate images simultaneously for precise and easy alignment (?5 ?m). Dual fiber optic illuminators allow for different light levels on the die and substrate, to enhance the alignment process. Motorized zoom and viewer movement also allow the operator to optimize viewing. The 410 is equipped with a 6 ? 6-in. heated stage with motorized travel in x, y, and theta, and precision servo-driven z motion with closed-loop bond control. Pentium processor-controlled profiles control temperature, bond load, machine sequences, and process times. Options for the 410 include a hot gas spot heating system for localized heating, or a high-intensity light spot heating system. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, fax 805/529-2193.