Post-CMP wafer cleaning

11/01/1996

Post-CMP wafer cleaning

The Capella, an advanced wafer cleaner for post-CMP applications (footprint 21 ft2), achieves high throughput due to its dual cassette load/unload stations, dual noncontact hydroplaned rinse rings, and dual high-speed spin dryers. Typically, fabs have used one post-CMP wafer cleaner system for every three CMP heads; with Capella, that figure increases to five or six CMP heads/system. Continuous reduction of particles and defects results from the use of double-sided PVA brush scrubbers with in-situ chemical dispersion, and noncontact wafer transport mechanisms. The tool also has distributed process control with SECS II interface, allowing complete wafer and tool monitoring while giving the operator total process flexibility. A color touchscreen monitor provides the user with real-time process recipe management to enhance tool optimization. Speedfam Corp., Chandler, AZ; ph 602/961-1600, fax 602/961-7577