Applied to study AI PVD with IMEC

11/01/1996

Applied to study Al PVD with IMEC

Applied Materials Inc., Santa Clara, CA, has entered into a three-year research collaboration in quarter-micron PVD metallization process technology with the Belgian research center, IMEC. As part of the agreement, Applied will also join IMEC`s Industrial Affiliates Program (IAP) on Advanced Metallization.

Under the agreement, Applied will install at IMEC an Endura HP PVD system with an advanced sputter etch module, and Coherent titanium/titanium-nitride and aluminum physical vapor deposition (Al-PVD) chambers. The system`s multichamber dual loadlock architecture allows the wafer to move through a staged vacuum sequence to achieve a base pressure of 10-9 torr to ensure maximum purity of the deposited films.

Researchers at IMEC`s facilities in Leuven, in cooperation with Applied`s PVD Division in Santa Clara, will use the Endura system to explore the limits of Al-PVD-based metallization processes.

Specific issues under investigation in the IAP metallization effort include optimization of contact and via fill processes, tungsten deposition and etchback, and alternative filling with a <400?C Al-PVD process. In addition, optimization of metal runners will be studied in the areas of texture, grain size, composition of the metal sack, and new aluminum alloys. Electromigration studies will cover fast migration tests with an emphasis on the detection of early failures, and influence of scaling. Stress migration aspects under investigation will include evaluation/optimization of measurement techniques and the effect of materials and processing. Finally, new integration schemes include damascene technology with aluminum and copper, low k dielectrics, and electroless copper deposition. - L.S.