Fully automated proximity mask aligner Fully automated proximity mask aligner

11/01/1996

Fully automated proximity mask aligner

Model 5000HPP high-performance proximity mask aligner is designed to provide precise alignment and lithography for conventional bumping or photosensitive polyimide processes. It can be used as a cost-effective lithography exposure tool when submicron feature sizes are not required. The standard 5000HPP handles up to 200-mm wafers, and the 5000PRX has been designed for 300-mm wafers. The standard system includes robotic handling, UV light intensity control and feedback, and an advanced auto-alignment system. For development purposes, the system can be configured without the robot or auto-alignment options, which can be added as modules subsequently. Printing resolution is at least 5 ?m at a 20 ?m proximity gap. OAI, Milpitas, CA; ph 800/843-8259 or 408/263-4944, fax 408/263-6389.