Thermally conductive adhesive

12/01/1997

Thermally conductive adhesive

Supertherm 2005 ultra-thermally conductive epoxy is a high-performance, solvent-free, diamond-filled adhesive. It is designed for die attach, sensor assembly, optoelectronics, clip-free heat sink attach, or module assembly where temperature-sensitive components/substrates are incorporated. Thermal conductivity is >1.0 W/mK, with good adhesion to die (>11 Kg). This low CTE epoxy absorbs stresses that develop during thermal cycling due to CTE mismatch between die and substrate. Supertherm 2005 bonds well to substrates that include silica, alumina, ceramics, plastic, glass, and metals. Tra-Con Inc., Bedford, MA; ph 800/872-2661, fax 781/275-9249.