High-throughput mask aligner

11/01/1997

High-throughput mask aligner

The MA150CC mask aligner handles 3-8-in. wafers and 6 ? 6-in. square substrates at a throughput of 120 wph (including autoalignment). It is especially suitable for exposure of thick resist and high topography and is mainly used for wafer-bumping and the production of MCMs, microsystems, and thin film heads. The pattern recognition system allows an autoalignment accuracy of 1.0 ?m. High intensity full field exposure optics contribute to efficiency by permitting shorter exposure times. Options include fully automatic bottomside alignment, the dual focus alignment system for alignment gaps of several 100 ?m, and large exposure gap optics. Karl Suss KG GmbH, Garching, Germany; ph 49/89-3200-70, fax 49/89-3200-7162.