Wafer stresses and displacements

11/01/1997

Wafer stresses and displacements

MacWafer is a specialized software tool for computing thermal and gravitational stresses in silicon wafers and the effect these stresses have on the allowable temperature variation, maximum temperature ramp rates, and maximum slip-free processing temperature. The interactive PC-based tool also computes wafer displacements and permits user-specified geometry of the wafer support, including multiple points and rings. This software tool is useful in designing processor and inspection hardware and process cycles for both single-wafer and batch tools. Sandia National Labs/SEMATECH, Livermore, CA; ph 510/294-3372, fax 510/294-1459, e-mail [email protected], www.ca.sandia.gov/macwafer/.