Solder removal system

11/01/1997

Solder removal system

The Scavenger system is a noncontact, automatic solder removal system for BGA rework. Using both thermal and vacuum technologies, it completely removes residual solder from BGA pads after removal of the defective device, allowing proper site preparation for the replacement BGA. The programmable nozzle both heats and draws away solder deposits simultaneously without touching the board surface, moving from pad to pad until the site is free of solder. Scavenger eliminates typical problems associated with "solder wick" methods or handheld tools, preventing damage to the solder mask and pads, and increasing the yield of the rework process. SRT, Westford, MA; ph 978/392-0633, fax 978/392-0638.