Target materials

11/01/1997

Target materials

These new target materials, for sub-0.25-?m design rules and 300-mm wafers, include copper, copper alloys, tantalum, tantalum alloys, and cobalt. They use a diffusion bonding process and nondestructive testing procedures to ensure good thin film quality, enhanced PVD performance, and low cost of ownership. The copper targets feature 6N purity with very low gas content and 50-?m fine grain size. Fine-grain tantalum targets give very consistent nitrided or non-nitrided films, and tantalum silicide alloy targets result in amorphous films that provide good barrier properties. Cobalt is available in 3N and 4N5 purities and uses a fabrication process that yields a relative permeability of <10 for enhanced target utilization. Tosoh SMD Inc., Grove City, OH; ph 614/875-7912, fax 614/871-9542, www.tsmd.com, e-mail [email protected].