Wafer dicing

11/01/1997

Wafer dicing

The NSX-250 single-blade wafer dicing system offers good machine rigidity, an overarm spindle support, three layers

of vibration isolation, Windows-based CNC controls, and MTIVision NT for automatic alignment, index correction, and inspection. The system gives high performance with low cost of ownership for dicing silicon, gallium arsenide, glass, and ceramics. System features include: aged Meehenite heavy wall castings; z over y design for stiffness and stability over the full travel range; and oversized precision rails and ball screws for stiffness and reliability. Full 4 axes CNC functionality allows interpolation, plunge cuts, in-process dressing programs, and multiple processes. Manufacturing Technology Inc., Ventura, CA; ph 805/644-9681, fax 805/644-3541, www.mtionline.com.