New Products
10/01/1997
Image analysis software
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PatMax machine vision software is a new method for locating and inspecting objects, features, and wafer and die patterns. Image processing software is used to manipulate or "clean up" a raw video image through such processes as image filtering and subtraction to generate another image as output. Building on existing capabilities of image processing and image analysis, PatMax moves to a new level, image understanding, knowing precisely where an object or feature is in an image despite changes in scale or rotation, and despite dramatic changes in appearance due to defects or partial occlusion. PatMax will enable vision systems to locate and precisely align the new generation of 300-mm wafers before such steps as probing, metrology, inspection, and bonding. Cognex Corp., Natick, MA; ph 508/650-3135, fax 508/650-3333, www.cognex.com.
High pin count ATE system
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The ValStar 2000 is an ATE system designed expressly for high pin count VLSI devices — an integrated solution for testing the complex logic, embedded memory and analog functions, and high-speed bus interfaces of such sophisticated devices as microprocessors, advanced chip sets, ASICs, and FPGAs. It offers up to 1024 I/O pins with a 200- MHz data rate. It also provides advanced structural testing capabilities with a 3-Gbit scan memory and a high-speed Iddq measurement capacity. The system occupies <4 m2 of fab space and is 1 m wide. ValStar 2000 allows effortless testing of up to 16 devices in parallel. Credence Systems Corp., Fremont, CA; ph 510/657-7400, fax 510/623-2524.
Laser marking system
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WaferMark Sigma XC is designed for portable Class 1 minienvironment operation and features a front-loading station that accommodates two stackable 13-wafer-capacity sealed cassette pods. Loading of the wafers into the marking chamber is accomplished via a pick-and-place robotic system with dual vacuum wand and optical alignment. An air filtration system maintains constant laminar flow and cleanliness during operation. Sigma 100 diode pumped laser technology provides highly stable control of the laser marking parameters, such as pulse energy, pulse length, and peak power. Marking mode is dot matrix SuperSoftMark; SEMI OCR, BC412, and other dot matrix formats are available. SigmaXC can be equipped with an optional vision system and SECS II/GEM interface. Footprint is 57.5 × 56.5 in. (width, depth). Lumonics Corp., Oxnard, CA; ph 805/485-5559, fax 805/485-3310.
Dicing saw
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This high-precision dicing saw features software that simultaneously displays all dicing parameters in an organized fashion for convenient management and provides a graphics view of the chuck and the wafer (size and location) to illustrate alignment locations and the proposed placement of cuts. New alignment schemes determine wafer center and wafer edge for enhanced production capability. The saw's motion axes are closed-loop control, employ Heidenhain high-resolution encoders, and are built from cast-iron slides mounted on a solid granite base. The full 360° rotatable chuck, 4-in. Z travel, and powerful 3HP spindle add to the tool's versatility. Thermocarbon Inc., Casselberry, FL; ph 800/523-1946, fax 407/767-8675.
P-GILD technology
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Projection-gas immersion laser doping (P-GILD) technology allows simple fabrication of ultrashallow (≤30 nm), low-resistance (<100 ohms/in2) source/drain extensions. A hybrid of lithography and diffusion, P-GILD is a resistless, step-and-repeat doping process that uses patterned 308-nm, XeCl excimer laser light to dope regions of an IC selectively. The excimer laser serves as a narrow-band, nanosecond-duration, pulsed-UV illumination source with an output directed through optics that homogenize and shape the light. Its uniform beam is directed onto a reticle that patterns the light, and is then imaged by a 4¥ projection lens onto the wafer, which is immersed in an ambient of the desired dopant gas. In the "exposed" regions, the silicon is rapidly heated to melting point by the intense laser irradiation. The resultant high temperatures cause dopant molecules on the wafer surface to diffuse into the molten silicon. P-GILD shortens thermal anneals to nanoseconds in duration and eliminates photoresist processing associated with selective doping. Ultratech Stepper Inc., San Jose, CA; ph 408/577-3116, fax 408/325-6444, www.ultratech.com
Epitaxial wafer measurement
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Epimet allows epi layer resistivity profiling by completely nondestructive measurements. A multipoint check of the wafer's resistivity takes only minutes. Measurements can be made straight out of the epi reactor, and no surface preparations are needed. Epimet uses an optical technique to sense resistivity as a function of depth; accurate and repeatable measurements can be made on same-type or cross-type epi wafers. System specifications include: resistivity range of 0.1–100 ohm-cm; epi thickness range of 1–100 µm; measurement time of 60 sec/point, typical; five-point measurement time with handling of 7 min, typical; unlimited number of measurement points; measurement area of 1 mm; edge exclusion of 10 mm; and 150-, 200-, and 300-mm wafer sizes. SemiTest Inc., Billerica, MA; ph 508/667-8783, fax 508/671-0812.
Class 1 cleanroom robot
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The six-axis SV3CR robot is designed for use in a Class 1 cleanroom environment and is suitable for wafer handling and interbay applications. It can also be used for wafer cassette handling, disk substrate and media handling, and flat panel display applications. The robot reduces particle contamination, thus improving yields, and can be integrated with a vision or laser sensing package for wafer mapping functions. Payload capacity is 3 kg (6.6 lbs), reach is 677 mm (26.6 in.), repeatability is ±0.1 mm (±0.004 in.), and weight is 30 kg (66.2 lbs). The SV3CR also features reliable, high-performance AC Sigma servomotors. The compact MRC IIs controller has a footprint half the size of a standard MRC; digital signal processors provide high performance and flexibility. Motoman Inc., Dayton, OH; ph 937/847-3300, fax 937/847-6277.
Single-chamber strip system
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Aspen Strip Turbo averages 130 wafers/hr in a single-chamber system for standard stripping applications. Using inductively coupled plasma (ICP) source technology (widely qualified in the field for processes down to 0.18 µm), the system optimizes strip processes for very good resist and residue removal and very low mobile ion contamination levels. It removes organic photoresist and inorganic residue in many IC applications, eliminating the need for post-strip and/or solvent processing. Unlike sequential strip-then-clean processes that sacrifice throughput for residue removal, Aspen Strip Turbo employs in situ cleaning, which is an all-dry clean in a single process chamber. Mattson Technology Inc., Fremont, CA; ph 510/657-5900, fax 510/657-0165, www.mattson.com.
Rapid thermal processor
Designed to handle 300-mm wafers during such processes as implant annealing, silicidation, and oxide growth, the Summit 300 RTP system uses a hot wall vertical reactor to heat a single wafer, combining RTP temperature ramping capability with vertical furnace reliability and repeatability. The system provides a constant heat source — a high temperature at the top of the reactor and a lower temperature at the bottom. The temperature of the wafer is determined by its position within the reactor. Eaton Thermal Processing Systems, Beverly, MA; ph 508/524-6426, e-mail [email protected].
Spin coater
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Model KW-4A is a spin coater for thin film deposition research and applications that features dual-speed controls with continuous speed adjustment and individual timers. Initially, the spin coater rotates at 500–2500 rpm, for a preset cycle time, and automatically switches to a high-speed range of 1000–8000 rpm. The process distributes the coating solution uniformly. Various chuck sizes are available. Chemat Technology Inc., Northridge, CA; ph 818/727-9786, fax 818/727-9477.
PECVD tungsten nitride process module
This tungsten nitride film is available for sampling on LYNX2, a modular, single-wafer CVD tool (originally called the Genus 7000 system). The film is a plasma-enhanced CVD barrier film that makes possible Gbit-scale DRAM device production by serving as the top barrier electrode for tantalum oxide capacitors. It is also a superior barrier for copper diffusion relative to titanium nitride and can be used as an adhesion layer for blanket tungsten. The film is amorphous as deposited at 325°C and remains so up to 500°C. It acts as a good barrier even when deposited to thicknesses of 75Å. Genus Inc., Sunnyvale, CA; ph 408/747-7120, fax 408/747-7199, www.genus.com, e-mail [email protected].
Negative ion beam source
The NMIBS-CS02 negative ion beam source, for direct metal ion beam deposition, provides precise control of the incident ion beam energy and the ability to fabricate controlled structures and controlled film properties. Features include a variety of beam species: C, Si, Au, W, Ni, Mo, Al, ITO, and SiC; rapid change of targets; and UHV compatibility. Beam size is 2–5 cm dia.; beam current is 10–100 µA; beam energy is 5–300 eV; and beam energy spread is ±10%. Skion Corp., Hoboken, NJ; ph 201/963-5450, fax 201/963-5449.
Boat inspection tool
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QBIS 7000 is a machine vision-based, noncontact tool that performs fast and accurate dimensional measurements on quartz and silicon carbide boats, as well as plastic cassettes. It has an accuracy of ± 0.0005 in. (± 0.0013 mm) over the entire 1.2-m inspection area and collects an average of 30 data points/min. If necessary, some 5600 data points can be collected from a single 139-slot boat. These data points are then used to calculate standard and user-defined measurements. August Technology, Edina, MN; ph 612/820-0080, fax 612/820-0060, e-mail [email protected].
Precision wafer saw
The high-performance APD1 precision saw accurately dices wafers of up to 4-in. diameter. It features: microprocessor control, allowing the operator to cut a wide range of crystal types with minimal kerf loss and good control of sample geometry; a combination of annular slicing and peripheral cutting; 40-mm depth of cut in annular mode; dicing of wafers up to 100 mm in dia.; drum speed up to 3000 rpm; and stepping accuracy to within 7.5 µm on both axes. Logitech Ltd., Westlake, OH; ph 216/871-0071, fax 216/871-8188.
Wafer alignment/orientation laser sensors
The PA series is a laser position CCD array micrometer, with a resolution up to 2.75 µm, that can measure wafer edge (including notch or flat) even with an edge gripper present. No controller is required and custom measuring tasks are possible. The PA also features a full digital computer interface, low nonlinearity, response time of 1.4 msec, and a high rejection of ambient illumination. HAMA Labs Inc., Palo Alto, CA; ph 415/856-2721 or 800/600-4262, fax 415/856-4948.
BGA shear test system
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The MBS200-3 BGA performs solder ball shear tests on ball grid arrays; it can test attachment of BGA balls up to 5 kg, both destructively and nondestructively. The system has auto tool touchdown and programmable shear tool height settings. Tool height is controlled automatically to a repeatability of better than 1 µm. Options include accessories for high-temperature testing and testing of flex circuit BGAs. Royce Instruments Inc., Napa, CA; ph 707/255-9078, fax 707/255-9079.
3-D noncontact profilometer
The Proscan 1000-BGA 3-D profilometry system has a comprehensive BGA software package for fast and accurate surface topography display, analysis, and measurement. Personnel can quickly obtain accurate measurements of solder bump position, height, diameter, placement errors, coplanarity, volume, number, and spacing on the PC board through automated math functions. The 1000's large-area, high-speed scanning capability and high measurement range with resolution to 10 nm allow the tool to measure complete BGA packages and other solder, interconnection, and test packages in a single scan from several microns to several mm high. Topography data points can be taken at speeds up to 2000 points/sec. Micro Photonics Inc., Allentown, PA; ph 610/366-7103, 610/366-7105, www.microphotonics.com
Automated fluid dispenser workstation
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This ergonomically designed workstation accommodates the Century Series C-702 or C-708 automated fluid dispensing systems. It offers enclosed space for a computer, optional modules, and general storage; the slide-out tray for keyboard with trackball and the swivel mount for the monitor create a flexible work environment. Adjustable feet allow easy height adjustment and leveling of the dispensing system. The workstation is 914 times; 838 mm in length and width, with minimum height of 737 mm. Asymtek, Carlsbad, CA; ph 800/279-6835 or 760/431-1919, www.asymtek.com, e-mail [email protected].
Turbodrag pumps
The TC600 is a turbodrag pump with an integrated turbo controller. By integrating the controller with the pump in a simplified, modular design, complicated connection cables and intricate installation are avoided. The pump's design features a simple plug-and-play principle, which saves space and cost. One TC600 unit controls all standard and corrosive pumps from 70–2200 l/sec. Peripherals including venting, interlocking backing pump control, heaters, and air cooling can easily be connected to the basic unit. Pfeiffer Vacuum Technology Inc., Nashua, NH; ph 603/578-6500, fax 603/578-6550, www.pfeiffer-vacuum.com.
Dry pump for harsh processes
The iH series dry pump is designed for high reliability, long MTBF, and low COO in etch, CVD, and other demanding processes in silicon wafer and FPD manufacturing. Pumping speeds address 300-mm requirements. The pump is well-suited to handling particulates and is easily tuned to handle condensable etch and CVD by-product equally well. Edwards High Vacuum International, Wilmington, MA; ph 800/848-9800, fax 508/658-7969, www.edwards.boc.com
Miniature vacuum gauges
Mini-Convectron gauges feature on-board displays in rugged miniaturized packages; they measure from 1 mtorr to atmosphere. Mini-Ion gauges measure pressure from 5 × 10-8 to 5 × 10-2 torr, using triode or Bayard-Alpert design. These gauges are particularly suitable for applications in which controller footprint and transducer size are critical. Granville-Phillips Co., Boulder, CO; ph 303/443-7660, fax 303/443-2546, e-mail [email protected].
Dry roughing pump
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The ADS1001 dry roughing system is an addition to the ADP/ADS family, extending pumping capacity to 1000 m3/hour for use with high-flow CVD furnaces and other high-flow processing systems. Consisting of an RSV1500 Roots blower mounted on an ADP81 Roots-style dry pump, the 1001 combines the rugged performance of the Roots system with an advanced, high-impedance lobe design, for reliability in the harshest processes. A built-in frequency converter produces higher pumping speed at higher pressures and greater starting torque. The pump is operated through the advanced M3 controller, which performs rotational speed control, nitrogen injection, thermal protection, fault indication, and is compatible with the Alcatel Supervision Network. Alcatel Vacuum Products, Hingham, MA; ph 617/331-4200, fax 617/331-4230.
Test wafer cleaning system
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This version of the Soniscan high-purity cleaning system has been designed to clean 300-mm test wafers, allowing their reuse without risk of equipment contamination. Soniscan incorporates "semiconductor-grade" ultrasonic cleaning with high-purity rinsing, capillary drying, and final noncontaminating N2 drying. This is incorporated into a single, compact console, which also includes on-board DI heating, 18 mW water polishing, and DI water reclaim. The systems are available in automated and semi-automated modes. Interlab Inc., Danbury, CT; ph 203/748-5624, fax 203/794-0209.
Balston stainless steel sample filters
Models 31S6, 31G, 41S6, 41G, and 91S6 are designed to protect process analyzers and monitoring equipment from sample impurities. They remove solids and liquids from gases with 99.99% efficiency at 0.01 µm, and solid particulate from liquids to 0.2 µm. Design features include 0.5-in. NPT ports, maximum temperature up to 400°F, and maximum pressure up to 500 psig. Whatman Inc., Haverhill, MA; ph 800/343-4048 or 508/374-7400, fax 508/374-7070.
SMIF-compatible wafer inspection
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The Axiospect wafer inspection system offers visual defect classification, second optical inspection, defect review, registrations, CD metrology, film thickness, and z-height measurement. It is a SMIF-compatible, minienvironment solution for Class 1 fabs, including the Axiotron 2 microscope, a three-axis wafer-handling robot, and Winspect software. All contrasting techniques are available. The robot features backside contact only, and onboard optical flat finder and macro inspection. The handler supports wafer diameters from 75–200 mm. Carl Zeiss Inc., Thornwood, NY; ph 800/233-2343, fax 914/681-7446, www.zeiss.com, e-mail [email protected].
Automated X-ray inspection
The CRX-3D microtomography X-ray system generates slice-by-slice images of ICs, components, and other devices. Faults detected include miswires, opens, shorts, and voids in flip chip, fine pitch, and BGA packages. The system rotates the component through 360° while the imaging camera takes individual video frames. Software then reconstructs the component interior. The X-ray sources offer levels up to 160 KeV and focal spot sizes <2 µm. CR Technology Inc., Laguna Niguel, CA; ph 714/448-0443, fax 714/448-0445, e-mail [email protected].
Integrated thickness monitoring for CMP
The NovaScan 420 ITM system permits product wafer metrology and mapping operations during the CMP planarization process. The system retains the benefits of stand-alone thickness measurement (accuracy, resolution, pattern recognition capability, and wafer mapping) and end-point detection (real time), and has capabilities that include: accurate thickness measurement data for every product wafer; measurements in parallel to the processing of the next wafer; and elimination of the additional cleanroom space and labor needed for intensive off-line measurements. Nova Measuring Instruments Ltd., Rehovoth, Israel; ph 972/8940-7778, fax 972/8940-7776.
Surface charge profiler
Based on a low-illumination ac-surface photo-voltage principle, model SCP-7200 provides a noncontact technique for rapid measurement of epitaxial layer resistivity. The SCP principle is sensitive to variations in doping concentration in the near-surface region. This noncontact measurement (air gap 0.1–0.2 mm) is nondestructive, interacting only optically with the wafer. Specifications include high-speed mapping, 60 wafers/hour at 600 points/wafer, and resolution up to 7500 points/wafer. QC Solutions Inc., Woburn, MA; ph 617/938-4030, fax 617/933-0675, email info@ qcsolutions.com.
Flexible moisture analyzer
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The Tracer quickly detects minute moisture upsets, while reliably monitoring moisture concentration at sub-ppb levels. With its small, modular slide-drawer configuration, two Tracers fit into the footprint of one standard 19-in. rack panel, allowing users to monitor two gases at one time, or to use the spare compartment to install other components, such as a printer, purifier, or other analytical system. The system features plug-and-play operation. Meeco Inc., Warrington, PA; ph 215/343-6600, fax 215/343-4194.
Active vibration control
STACIS 2100 is an active vibration control system that has payload and floor sensors to provide extensive vibration performance monitoring and improved vibration isolation and settling times. The STACIS line uses a combination of piezoelectric actuators and elastomer mounts for active control of vibration starting at 0.3 Hz, with about 80% isolation at 1 Hz and >90% isolation at frequencies >2 Hz. Barry Controls, Brighton, MA; ph 617/787-1555 ext 210, fax 617/787-3934.
Power interruption safeguard
The Voltage DIP-Proofing Inverter (DPI) offers a maintenance-free, batteryless solution to costly disruption of critical production processes. It maintains AC control voltage to sensitive process equipment and motor control centers during momentary power interruptions and voltage sags by supplying ultrafast standby power to such items as contactors, relays, PLCs, small power supplies, and other sensitive equipment. The DPI is small, light, and easy to install and retrofit; it features adjustable ride-through for different applications and meets ISO 9000 standards. Dip-Proofing Technologies Inc., West Los Angeles, CA; ph 310/820-6188, fax 310/442-8416, e-mail [email protected]
Mass flow controller
The Tylan UHP2000 thermal mass flow controller is designed for such processes as metal etch, silicon nitride, CVD, and other applications that produce condensable or particle by-products. An all-metal flowpath minimizes moisture retention and gives better corrosion resistance. The controller also features laminar flow throughout with a fully swept, gas-wetted flowpath and a diaphragm sealed solenoid valve, resulting in fast drydown and reduced dead volume that minimizes contamination. Millipore Corp., Bedford, MA; ph 617/533-2956, e-mail [email protected].
Multigas analyzer
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The Multi-Gas 2010 analyzer, based on FT-IR spectroscopy, simultaneously measures the concentrations of more than 20 gas species, even with high levels of moisture. Users can select a variety of heatable gas cells from 1.0 cm single-pass to 20 m multipass. The system is run with a desktop or laptop computer, and reference spectra for up to 50 gases can be stored in memory. Sensitivity down to 10 ppb is possible for many species. On-Line Technologies Inc., East Hartford, CT; ph 860/291-0719, fax 860/289-7975.
Diaphragm seal valves
These 1/4-turn, diaphragm seal valves, for use with high-purity specialty gases, provide the convenience of conventional 1/4-turn ball valves plus a higher degree of leak integrity, ensuring gas purity (leak rate <1 × 10-8 scc/sec of air). The valves can operate at pressures from vacuum up to 3000 psig. Series SG5440 and SG5450 valves are available in either brass or Type 316L stainless steel construction — suitable for both corrosive and noncorrosive applications. Advanced Specialty Gas Equipment, South Plainfield, NJ; ph 908/753-4655, fax 908/753-1540.
Silane generator
This generator produces silane on demand, in a unit about the size of two filing cabinets. It can be safely placed within the fab to eliminate expensive gas cylinder storage bunkers and piping. Generators are available with various flowrates. Electron Transfer Technologies, Edison, NJ; ph 908/225-3995, fax 908/225-3580, www.pingsite.com/ett.
Trace oxygen transmitter
The series 3500 trace oxygen transmitter provides an accurate and economical method of measuring trace (ppm) concentrations of oxygen in other gases. It is a blind transmitter powered from 12–32 VDC with a corresponding analog output of 4–20 mADC, and is suitable when a PLC, datalogger, recorder, or DSC is in use. Alpha Omega Instruments, Cumberland, RI; ph 800/262-5977 or 401/333-8580, fax 401/333-5550.
Automated proximity exposure system
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Model 5000 is a high-performance proximity mask aligner and exposure system designed to provide precise alignment and lithography for conventional bumping or photosensitive polyimide processes. It features advanced electronic circuitry, a graphical Windows user interface, and auto-alignment capability. The standard 5000 handles wafers up to 200 mm, and the expanded version, the 5000EX, can handle 300-mm wafers. The standard system includes robotics handling, UV light intensity control and feedback, and an advanced auto-alignment system. For development purposes, the system can be configured without the robot or auto-alignment options, which can be added subsequently as modules. Printing resolution is at least 5 µm at a 20-µm proximity gap. OAI, Milpitas, CA; ph 408/263-4944 or 800/843-8259, fax 408/263-6389.
Laser beam profiler
SpotScan is a profiling system for measuring the energy distribution of micron to submicron beam widths; it aids in the assembly, adjustment, and qualification of optical systems with finely focused beams. The system views the energy distribution directly at the focus, junction, or output of a diffraction-limited beam as small as 0.3 µm in dia. SpotScan employs a scanning aperture technique to measure spot intensity, the impact on resulting power density, optimum focal point positioning, degree of source astigmatism, and presence of aberrations. Photon inc., Santa Clara, CA; ph 408/492-9449, fax 408/492-9659, e-mail [email protected].
Large area laser lithographic system
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The Direct Write Laser System is designed for the manufacture of large-format, high-precision patterns and masks. It can directly write precision patterns up to 32 × 24 in. (800 × 600 mm) with features down to 2 µm. Precision mechanics are combined with an error-tolerant, computer-controlled, real-time correction system. A planar two-axis laser interferometer with compensation for temperature and atmospheric pressure variations determines the precise stage position with respect to the write lens unit, with a resolution of at least 50 nm. IMT Masken und Teilungen AG, Greifensee, Switzerland; ph 41/1944-2740, fax 41/1944-3035.
DUV optical component inspection
The WYKO DUV optical component inspection system is a dual-wavelength, ultraviolet interferometer that qualifies key optical materials, components, and subassemblies used in DUV lithography systems for 0.25-µm applications. The noncontact instrument makes accurate measurements of transmitted wavefront aberrations for optics such as beam-splitting cubes, lens assemblies, and UV materials. At 257.2 nm, the instrument has absolute accuracy of λ/20 P-V and λ/100 RMS and repeatability of λ/40 P-V and λ/200 RMS. WYKO Corp., Tucson, AZ; ph 520/741-1044, fax 520/294-1799, www.wyko.com, e-mail [email protected].
KrF excimer laser
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KLES-G10K is a KrF excimer laser light source for steppers designed for 0.3-µm device geometries. Throughput is improved by the increased laser oscillation frequency (from 600 to 1000 Hz), which is made possible by the use of a newly developed solid-state power source. Running costs are reduced by the use of an RF system for preliminary ionization of the electrical discharge part. This new system can double the durability of a laser chamber while reducing gas consumption to one fourth of that of a conventional system. Other key specifications of the KLES-G10K are: oscillating wavelength of 248 nm; pulse energy of 10 mJ; average output of 10 W; spectral linewidth (FWHM) <0.65 pm; integrated energy stability <±0.8%; core wavelength stability <±0.1 pm; gas life of 100 m pulses (or seven days); and gas types Kr, F2, and Ne. Komatsu Ltd., Oyama, Japan; ph 81/03-5561/2616, fax 81/03-3505/9662.
Stepper productivity enhancement
Nikonnest is a field-upgradeable, PC-based productivity enhancement capable of substantially improving throughput on this company's Model 6–10 step-and-repeat (NSR) lithography systems. Using a GPIB communication driver, Nikonnest reduces overhead time by allowing various I/O routines to operate as much as 200% faster, as well as permitting reductions in the time needed to perform preventive maintenance. Offering enhanced storage capacity and Ethernet capability, this fully integrated, rack-mounted system fits within the standard MCS-II NSR control rack and operates at twice the speed of the system that it replaces. Nikon Precision Inc., Belmont, CA; ph 415/508-3819, e-mail [email protected].
Defect analysis software
This auto defect analysis software package is designed for the Link ISIS x-ray microanalysis system on the JEOL JWS wafer inspection systems. The software is useful in fabs where x-ray microanalysis is used to analyze contaminant particles located by defect review tools. The system is fully automated, and once EDX microanalysis is activated, the operator is led through a tailored microanalysis sequence; the results can be stored for later investigation, if required. Analytical results can be presented as elemental compositions or by comparison with a pre-defined database of defect materials. The Link ISIS system and the JWS are operated through the same keyboard, monitor, and mouse, reducing footprint and simplifying operation. Oxford Instruments, Microanalysis Group, Concord, MA; ph 508/369-9933, fax 508/369-8287, e-mail [email protected].
Interconnect analysis software
Version 4.1 of Raphael, an interconnect analysis software package for IC design, includes enhancements to the Raphael Parasitic Database (RPD), and Raphael's optional Layout Parameter Extraction Advanced Application Module (LPE-AAM) offers interface capability to additional LPE tools from leading EDA suppliers. The RPD features a user-selectable planarized vs. nonplanarized technology option. Nonplanarized technology means that the effective accumulative dielectric thickness between conductors of different layers is approximately reduced by the thickness of the missing conductors in the intervening conductor layers. The user can generate capacitance tables from RPD to view the simulated results in tabular form. Technology Modeling Associates Inc., Sunnyvale, CA; ph 408/328-0930, fax 408/328-0940, www.tmai.com.
Inorganic spin-on polymer
This inorganic (carbon-free) spin-on polymer decreases the number of layers that require CMP and allows a non-etchback gapfill process. Spin-on dielectrics provide opportunities to extend beyond 0.35 }mum because some promising low-k candidates are deposited by the spin-on process. Also, a spin-on solution eliminates the possibility of plasma damage. ACCUSPIN T-22 achieves gapfill results to 0.05 }mum, which is superior to results demonstrated for CVD dielectric deposition processes. AlliedSignal Electronic Materials, Los Gatos, CA; ph 408/341-3055, fax 408/341-3001, e-mail [email protected]
Dual-arm robot
The DBM 2400 series dual-arm atmospheric robot handles both 200- and 300-mm wafers. With a 2–3 sec wafer swap time, it offers higher throughput than conventional dual-arm designs, with a smaller footprint. The robot has been designed for single-wafer applications and is based on a direct-drive motor technology. Its performance is achieved by high-torque characteristics and by minimizing the use of transmissions and reductions, resulting in a virtual zero-backlash design. MTBF is 75,000 hours. Equipe Technologies Inc., Sunnyvale, CA; ph 408/522-0350, fax 408/522-0358, www.equipetech.com/, e-mail [email protected].