Services
10/01/1997
Packaging technology book
This book titled Roadmaps of Packaging Technology covers basic to state-of-the-art packaging technologies, including BGAs, chip-scale packages, flip chip, MCMs, chip on board, fine-line substrates, build-up multilayer boards, thin-film substrates, heat pipes, switching noise, transmission lines, interconnect density, solder joint reliability, 3-D packaging, cryogenic processors, and quantum computing. The source also provides a complete explanation of terms, maps out future technology and related applications, and gives an overview of the industry and its drivers. ISBN 1-877750-61-1. Price: Book or CD-ROM, $850. Integrated Circuit Engineering (ICE), Scottsdale, AZ; ph 602/368-8260, fax 602/948-1925, e-mail [email protected], www.ice-corp.com/ice.
Mobile laser service center
A fleet of vans and mobilized field engineers, "Uptime Experts," is available 24 hr/day to service a line of industrial laser systems. Regional Customer Centers, located in Livionia, MI, Singapore, and Munich, Germany, can access a customer's complete laser installation and service history; problems can often be solved on the telephone with no service charge. However, if new parts are needed, they are shipped the same day. If equipment requires on-site attention, arrangements are made for a certified engineer to be at the plant in 24 hr or less. The "Uptime Experts" service also provides five programs for planned maintenance of equipment. Lumonics Inc., San Francisco, CA; ph 613/592-1460.
Fall microtechnology training courses
These IEE-accredited training courses are offered for professional development in microelectronics. "Wire Bonding for Microelectronics" will be held November 25–27, and will cover technologies and methods of connecting active devices to packages and substrates; ball forming; ball and wedge bonding; materials — Au, Al, Cu wires, 25–75 µm; substrates and metallizations; failure mechanisms and solutions; machine parameters; and best practices for industry. "Die Attach for Microelectronics" will be offered December 2–3, and will cover the technology and methods for attaching active and passive semiconductor devices on substrates and in packages; materials; methods; substrates and metallizations; cleaning; defect identification and solutions; reliability; and inspection and test methods for quality control. Price: "Wire Bonding for Microelectronics," £845 + VAT; "Die Attach for Microelectronics," £570 + VAT. The Welding Institute (TWI), The Microtechnology Centre, Cambridge, UK; ph 44/1223-891162, fax 44/1223-892588, e-mail [email protected], www.twi.co.uk/industry/microtec/.
Vacuum training process system
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This system provides hands-on training in operating vacuum equipment. Equipped with a 722 Baratron capacitance manometer with 0.5% reading accuracy, the Type VTS-1B vacuum system comes as a kit with a guide that describes setup and use, and includes learning demonstrations, exercises, and worksheets for learning the principles of vacuum. Users will gain experience with vacuum components; gauging; mass flow control; pressure control; calibration principles of flow and pressure devices; and control systems; they can also observe the effects of vacuum in the transparent chamber. The system uses a Type 146 Cluster Gauge Measurement and Control System in conjunction with the user's PC to provide setup, control, and display of various aspects of system operations. A High Vacuum Modification Package, which includes all the necessary fittings, isolation and roughing valves, and gauging to permit a small turbo pump and RGA in the VTS-1B, is optional. The system's configuration allows an RGA to be differentially pumped through a sampling orifice. MKS Instruments Inc., Andover, MA; ph 800/227-8766, fax 508/975-0093.
Wire bond interconnection CD-ROM
This multimedia handbook and interactive training program titled "Wire Bond Interconnection Technology" is based on 14 years of teaching experience with more than 1500 engineers and managers from 23 countries. Features include animations, interactive equations, voice explanations, hyperlinked text, fast-find glossary, graphs, figures, self-test modules, database, troubleshooting guide, and videos. The CD-ROM is the first in a planned series on VLSI assembly and packaging that has been designed to revolutionize the way information is provided to professionals in the field. Price: Demo CD-ROM, $39; complete CD-ROM, $995. Assembly & Packaging Technology International, Brookings, SD; ph 605/692-5220, e-mail [email protected].
IC unit container packing guidelines
This document titled "Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing" (EIA/JEDEC Publication No. 130, EIA/JEP130) establishes guidelines for IC unit container and intermediate container packing and labeling. These include tube
ail standardization; intermediate packing; date codes; tube labeling; intermediate container and shipping labels; and standardized tube quantities. Future revisions of the publication will also include tray and reel guidelines. The objective of the document is to promote the standardization of practices between manufacturers and distributors, resulting in improved efficiency, profitability, and product quality. EIA/JEP130 was developed through a NEDA-sponsored industry task force comprised of member distributors and manufacturers, and subsequently reviewed and approved by the JC-14.4 Committee on Quality Systems Standardization under the chairmanship of Greg Foulger of Motorola Inc. Price: $31. Global Engineering Documents, Englewood, CO; ph US and Canada 800/854-7179 or international 303/397-7956.
Expanded flip chip e-mail forum
In an effort to spread the knowledge and use of flip chip technology beyond a handful of large companies, the National Electronics Manufacturing Initiative (NEMI) has joined the Institute for Interconnecting and Packaging Electronic Circuits (IPC) to expand IPC's e-mail help forum, ChipNet. The ChipNet forum has been used as a communication vehicle for members of technical committees developing the IPC J-STD-012, Implementation of Flip Chip and Chip Scale Technology. This standard deals with flip chip and chip-scale development and performance standards, flip chip substrate assembly designs and performance standards, and material performance standards used in flip chip and chip-scale manufacturing and assembly. NEMI is an industry-led consortium dedicated to improving the infrastructure of electronics manufacturing in North American companies; it has focused on flip chip technology as a primary factor in the improvement of the industry. ChipNet is open to anyone who is interested in learning about flip chip technology. To sign up for the forum, send an e-mail to [email protected]. In the body of the e-mail, provide the following information: Subscribe ChipNet <user name>. IPC, Northbrook, IL; ph 847/509-9799 ext. 340.
Japanese FPD report
This publication titled The Future Prospects for the Liquid Crystal and Related Display Markets Report was developed by the Japanese research organization, The Fuji Chimera Research Institute, for the Japanese display industry, and has been translated into English. It contains information gathered through extensive interviews with Asian industry leaders, and covers application trends; trends in the demand for materials and components; technology trend projections; pricing projections; market share projections for Japan, Korea, and Taiwan by technology and manufacturer; and engineering trends. More than 450 detailed charts and tables useful for planning and presentation purposes are also included. ISBN 1-884730-10-8. Price: $895. InterLingua Linguistic Services Inc., Redondo Beach, CA; ph 310/792-3636, fax 310/792-3642, e-mail [email protected], www.displaylibrary.com.