Wedgebonder for 55-um manufacturing

09/01/1997

Wedge bonder for 55-?m manufacturing

Model 8060 is an aluminum and gold wedge bonder that is designed to accommodate the most difficult packages. Improvements in productivity are made possible by a new, lightweight bondhead and x-y table, as well as a new material-handling system. The rotating bondhead can accommodate the most complex device types, including strip or leadframe packages. A 2.5 ? 2.5-in. bonding area (5 ? 5-in. max. device size) makes the 8060 suitable for a wide range of devices, such as microprocessors, chip on board modules, microwave (RF) devices, MCMs, BGAs, and hybrids. The bondhead features the Unibody high-frequency transducer, which uses 120 kHz energy to decrease bond squash and bonding time, reducing pad pitch and increasing throughput. The 8060`s material-handling system uses operator-managed, fully programmable automated conversion technology to allow a full changeover in <5 min. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, www.kns.com.