Ion beam milling and imaging Ion beam milling and imaging

09/01/1997

Ion beam milling and imaging

The FIB 200DE fully digital focused ion beam milling and imaging tool is designed for device editing and analysis of advanced ICs, including flip-chips. It features a laser interferometer stage and high-intensity ion column for sharp milling and imaging of multilayered devices at high resolutions. Circuit design/debug times are considerably reduced through powerful operator interfacing, rapid CAD overlays of circuit designs, and automated actions. The high-intensity column with optimized gas delivery system provides backside silicon removal for rapid circuit access. The FIB 200DE can be used for both circuit design and failure analysis. Its tilting, five-axis stage is well-suited to cross-sectioning, imaging, and measuring samples to search for the subsurface or surface defects that may cause IC malfunction. FEI Co., Hillsboro, OR; ph 503/640-7500, fax 503/640-7509.