RTP system

09/01/1997

RTP system

The RTP XE Centura rapid thermal processing system incorporates enhancements to the wafer transfer sequencing of the established RTP Centura system, boosting throughput to >100 wafers/hour. Power consumption has been lowered by as much as 40% through the use of high-efficiency lamps and other modifications. A key innovation is TempMatch technology, which allows multiple RTP Centura systems - within a fab or at several fabs - to be rapidly and precisely temperature-matched for identical process results. This temperature calibration tool permits process temperature to be calibrated to ?2?C from chamber to chamber, compared to >5?C for thermocouple calibration methods. Applied Materials Inc., Santa Clara, CA; ph 408/727-5555, fax 408/986-8352, www.AppliedMaterials.com.