Die bonder and component placer

09/01/1997

Die bonder and component placer

The T-3102 die bonder, which can be changed from manual operation to fully automatic at the touch of a switch, removes die by pulling down the foil while the die, supported by the fixed needle, remains stationary. Consequently, there are no dynamic forces arising through the acceleration of the die and all pickup tool assembly parts. This reduces the danger of die failure and surface damage, and ensures higher alignment accuracy between the pickup tool and die ejector needle. Other features of the T-3102 include the ability to pick up a wide variety of devices for placement and bonding, including die from wafers up to 8 in., from a waffle pack, or from feeders. Fancort Industries Inc./Dr. Tresky AG, West Caldwell, NJ; ph 201/575-0610, fax 201/575-9234, e-mail [email protected].