Chipscale packaging assembly system

09/01/1997

Chip scale packaging assembly system

The 505 CSP system is used to manufacture ?BGA and chip scale packages. It removes chips directly from a diced wafer and places them (flipped) pattern-down onto CSP polyimide tape (interposer) mounted on lead frames or indexed reel-to-reel. Real-time alignment is used to align the pads on the chip with the features on the CSP tape to within 5-?m accuracy. The system operates at a rate of 1500/hr. MRSI, Chelmsford, MA; ph 508/256-4950, fax 508/256-5120