Furnace for C4 reflow

09/01/1997

Furnace for C4 reflow

The TCAS controlled-atmosphere furnace is designed for both high- and low-temperature C4 reflow applications. It provides the temperatures and atmospheres required for wafer bump reflow, chip interconnect reflow, and final underfill and sealing cure. An advanced gas barrier system maintains hydrogen atmosphere purity to better than 95%. TCAS meets cleanroom requirements (typically Class 1000 or better), with quartz tubes to minimize friction and reduce belt particles, gas-tight curtains to seal the metal muffle, and a fully enclosed heated case to prevent furnace insulation from being emitted into the room. It is available with a fully integrated cassette-to-cassette handling system for both 200- and 300-mm wafers. BTU International, North Billerica, MA; ph 508/667-4111, fax 508/667-9068, www.btu.com, e-mail [email protected].