Cluster tool for low-k spin-on dielectric processing

09/01/1997

Cluster tool for low-k spin-on dielectric processing

The LK 800 IMD processing system delivers superior planarization of 40-80% over wide metal lines and spaces (to 200 ?m). In addition to providing good film thickness distribution and <1% nonuniformity, the process design reduces contamination and environmental sensitivity. Multiple single wafer curing options are available, including 500?C hotplate, e-beam, and DUV technologies. The hotplate provides heating and cooling in an inert ambient with rapid, in-situ cool down to <200?C. Fairchild Technologies, Fremont, CA; ph 510/659-8370 ext. 274, fax 510/659-9407.