Shallow trench critical etch process

09/01/1997

Shallow trench critical etch process

The 6510 HRe shallow trench isolation process module features 75-89? variable programmable profile control, ensuring the integrity of subsequent deposition processes. The process module is targeted at 0.18- and 0.25-?m shallow trench isolation applications, where top- and bottom-corner rounding is a critical requirement. Tegal Corp., Petaluma, CA; ph 707/763-5600, fax 707/765-9311, e-mail [email protected].