Cleaning development program

09/01/1997

Cleaning development program

The Critical Cleaning 2000 Development Program aims to increase the cleaning process knowledge of original equipment manufacturers and establish cleaning benchmarks for next-generation wafer manufacturing. The semiconductor industry is projected to manufacture most computer chips in the 0.35-0.25 ?m linewidth range by the year 2000; this level of production requires critical cleaning processes that effectively remove minute particles and leave no residue. Offering manufacturers the ability to work directly with engineers in developing new process and product solutions, the Critical Cleaning 2000 Development Program is designed to facilitate future critical cleaning performance. Rippey Corp., El Dorado Hills, CA; ph 916/939-4332, fax 916/939-4338, www.rippey.com