Inspection system for CMP

09/01/1997

Inspection system for CMP

The KLA-2138 is a patterned wafer inspection system that addresses CMP and other advanced applications; it is optimized for metal and trench CMP. Based on the 2135 inspection platform, the 2138 combines an ultra-broadband illumination source and improved bright field optics with Segmented Auto Thresholding. Together, these increase defect sensitivity and capture, while reducing or eliminating false defect counts in challenging processes. The system also features IMPACT/Online ADC, which provides true on-line automatic defect classification. ADC matching capability allows chipmakers to develop consistent CMP defect classification schemes and accelerate the transfer of CMP inspection processes, both within the fab and between fabs on a global basis. KLA-Tencor, Milpitas, CA; ph 408/875-7039, fax 408/875-3030