Automated stress measurement

09/01/1997

Automated stress measurement

FSM128C2C is a fully automated stress measurement tool for 300-mm wafers. It features an integrated SMIF minienvironment and SECS/GEM compliance. Throughput is 80 wafers/hr for a 300-mm scan. The number of data points is up to 12,000, for good data integrity. Auto Dual Laser, Auto Calibration, and Auto Intensity ensure complete automation, regardless of film material and thickness. The Auto Wafer Thickness Measurement option accurately measures wafer substrate thickness and inputs it into the system for stress calculations. Frontier Semiconductor Measurements Inc., San Jose, CA; ph 408/452-8898, fax 408/452-8688, e-mail [email protected]