Surface profiler

09/01/1997

Surface profiler

The MP3000 noncontact automated wafer profiling system measures the polished side, back side, and edge of 200- and 300-mm wafers. It is a single, ergonomically designed workstation consisting of a laser-based, noncontact surface profiler, an automated staging mechanism that can position the wafers in five orientations, a robotic cassette-to-cassette transfer mechanism, and computer hardware and software for producing real-time views and full-color reports of microscopic surface measurements. Designed for both R&D and production environments, the MP3000 offers spatial resolution approaching that of an atomic force microscope while providing scanning capability over much longer distances. Up to 500,000 data points are sampled at a time for rapid profiling of surface features such as roughness and waviness. Chapman Instruments, Rochester, NY; ph 716/424-1380, fax 716/424-2142.