Thermal Design Book

08/01/1997

Thermal design book

This 336-page book titled Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach contains information on the effects of operating temperatures on microelectronic devices, and provides a scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape-automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models are used to derive derating criteria for determining the max. and min. allowable temperature stresses for a given microelectronic package architecture. Authors: Pradeep Lall, Michael Pecht, Edward Hakim. ISBN 0-8493-9450-3. Price: $69.95. CRC Press, Boca Raton, FL; ph 800/272-7737 or 561/994-0555, fax 800/374-3401, e-mail [email protected], www.crcpress.com.