UV Curing Systems

08/01/1997

BGA die bonder

Model 2007 BGA`s clamp feeder system is driven by linear motor technology that ensures accurate leadframe transportation. Vision systems measure the real bond pad position and provide high bond accuracy. A fully programmable dispenser system, using a true volumetric piston pump, provides control of bond line thickness and die tilt. An integrated quality control system automatically controls bond quality, and the flexible wafer handler allows the use of wafer sizes up to 8 in., with a fast exchange between sizes. ESEC, Cham, Switzerland; ph 41/41-749-5111, fax 41/41-741-6484.