Dry Process silicon dicing

08/01/1997

UV curing systems

Models UH101 and UH201 UV curing systems provide a highly controlled environment to ensure uniform exposure of wafers up to 200 mm in diameter. The UV adhesion reducing curing process offers several improvements over traditional irradiation methods; these include easier post-saw die removal

than with conventional films, increased yield over higher adhesive films, and low-stress removal of the film from ultrathin or fragile wafers. Both systems accept any size of wafer saw frame and feature N2 purge for complete curing of the adhesive. Ultron Systems Inc., Moorpark, CA; ph 805/529-1485, fax 805/523-1061, www.ultronsystems.com